Cnergenz Berhad (“Cnergenz” or the Company”) was incorporated in Malaysia on 6 August 2021 as a private limited company under the name Cnergenz Sdn Bhd to facilitate our listing on the ACE Market of Bursa Malaysia Securities Berhad.

Cnergenz is primarily an investment holding company. Through our subsidiary, SiP Technology Sdn Bhd, we are principally an electronics manufacturing solutions provider, specialising in surface mount technology (“SMT”) manufacturing solutions for the electronics and semiconductor industries (“E&S Industries”).

Our solutions and services are typically provided to customers who are looking to commission new integrated production lines or automate their production facilities, catered based on each customer’s operational requirements, budget and capital expenditure.

CNERGENZ mainly serves electronics and semiconductor companies which carry out the assembly of the advanced semiconductor packaging products as well as assembly and testing of printed circuit board assembly (“PCBAs”).